•  System Software  •  Closed Loop Water Cooled
Filament  •  Digital High Drive Module (Optional)  •  Analog High Drive Module (Optional)  •  Bar Code Reader (Optional)  •  Printer (Optional)  6300138-05  MEASUREMENTS  •  Motional Capacitance  •  Motional Inductance  •  Trim Sensitivity  •  Quality Factor     •  Series Resonant Frequency  •  Load Resonant Frequency  •  Resistance  •  Shunt Capacitance  SYSTEM CONFIGURATION  •  Vector Voltmeter  •  Dual Output Synthesizer  •  X-Y Table Assembly  •  Turbo or Cryo Pump  •  Direct Drive Roughing Pump  •  Computer  •  Light Pole  SAUNDERS & ASSOCIATES, INC.  FACILITY REQUIREMENTS  •  Power:  220 Volts @ 30 A or 380 Volts @ 20 A, 3-Phase  •  Inlet Pressures:  150 PSIG Maximum  •  Air:  90 PSIG  •  Nitrogen:  20 PSIG (Turbo), 70 PSIG (Cryo)  •  Cryo Water Cooling:  0.5 GPM @70 ? F, typical  •  Dimensions:  52.5 x 34.5 x 55 Inches (excluding light pole & cryo   compressor) (133.4 x 87.6 x 139.7cm)
Cryo pump compressor 19.5 x 24 x 19 inches
(49.2 x 61 x 48.3 cm) Light pole 39.5 inches (100.3 cm)

 Leaded  S&A  5510B QUARTZ CRYSTAL  PLATING SYSTEM  •  Quartz Crystal final frequency adjust  plating system  •  Measures and plates two crystals
simultaneously  •  Measurement parameters are checked
against Q.C. limits after plating  •  Measurement data may immediately be  stored and/or printed  •  Optimizes work area by using minimal  floor space  •  Leaded devices held in linear transports  •  Surface mount devices held in component
tray or customer specified pallet array  SPECIFICATIONS  Frequency Range:  3 MHz - 300 MHz  Plating Performanc e:  ± 2  ppm  typical final frequency  •  The component tray can accommodate
as many as 288 devices for smaller SMD
packages.  •  The component area is customized to
precise device size requirements  •  Precise X-Y table positioning  •  Supports MCF or Oscillator plating with
easy to install conversion kits.  160
Position
Pallet
Tray  Device
Tray